TrondheimTechFestival

Nordic Chip Meet-Up in Trondheim

Dag 1 av 2Tirsdag 29. sep
Tidspunkt09:00–16:30
StedDigs, Main Stage
Dag 2 av 2Onsdag 30. sep
Tidspunkt09:00–15:00
StedDigs, Main Stage
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Tirsdag 29. sep
Onsdag 30. sep
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  • KI
  • Engelsk
Close-up of a microchip on a circuit board, lit in green and amber.

A two-day gathering in Trondheim bringing together Nordic and European stakeholders from industry and academia to collaborate on the future of semiconductors

Join us in Trondheim this September for the Nordic Chip Collaboration Meetup, a side event of the Trondheim Tech Festival, where industry and academia come together to shape the future of semiconductors in the Nordic countries.

Over two days (29–30 September), we will bring together key players from across the Nordics to share insights, collaborate, and explore new opportunities in chips, design, and advanced technologies. Building on the success of our previous events in Helsinki (2024) and Lund (2025), this gathering will unite stakeholders from across the Nordic and European chip ecosystem to strengthen partnerships and foster collaboration.

Day 2 of the Nordic Chip Collaboration event will offer participants the opportunity to experience the ecosystem first-hand through industry visits in Trondheim. Participants will gain unique insights into leading Nordic companies and research environments, exploring how innovation in semiconductors is applied in practice and creating value across the semiconductor value chain.

Visits to: Nordic Semiconductor, Arm Norway and Microchip. The site visits day will run from approximately 09:00 to 15:00 (times to be confirmed).

Program

Day 1 will be located at DIGS, Krambugata 2, Trondheim and runs from 09:00 to approximately 16:30, followed by an optional networking dinner. Day 2 is a day of three site visits.

Please note that the afternoon sessions on Day 1 run as two parallel tracks — you choose one session from each pair. Coffee breaks and lunch are included throughout the day. This is an indicative program and may be subject to change.

Day 1 - 29 September

Location: DIGS, Krambugata 2, Trondheim

Agenda

9:00 - 9:30 Registration & Coffee

9:30 - 9:45 Welcome address

  • Nordic Chip Collaboration: Steinar Brede, Innovation Norway
  • Lisa Marie Dickson, Senior Advisor International Business Relations, City of Trondheim
  • Nordic perspective: Joonas Leppänen, Nordic Innovation

9:45 - 10:15 Keynote: The EU Chips Act 2.0: an ecosystem approach to technological sovereignty

  • Zeno Tornasi, European Commission

10:15 - 11:30 Opening session: Chip design as a Nordic stronghold

The Nordics have built a strong and globally competitive position in chip design across wireless, sensing, embedded systems, and advanced ASICs. This session highlights key strengths, success factors, and opportunities to further scale in a global landscape.
Introduction: Toni Mattila, Business Finland

Keynote presentations by:

  • Vegard Wollan, CEO, Nordic Semiconductor
  • Veijo Kontas, PhD, CEO of Wstcon Oy, Senior advisor at FiCCC / Tamllink
  • Fredrik Tillman, Senior Research Manager, Ericsson Research

Panel discussion:

  • Moderator: Toni Mattila, Business Finland

⏤

11:30 - 12:30 Lunch break

⏤

12:30 - 14:00 Early afternoon · Choose one of two parallel sessions

SESSION A / 1st floor: Behind the EU Chips Design Platform (EuroCDP)

EuroCDP aims to strengthen Europe's semiconductor design capacity by connecting design tools, IP, training, funding and access to fabrication and testing. The session explores platform vision, expected impact and how industry and research can engage.
Introduction: Pier Paolo Aurino, SCCC

Confirmed speakers:

  • Romano Hoofman, Strategic Development Director, imec
  • Vemund Bakken, CTO and Founder, Onio
  • Elina Mielityinen, Project Manager at Tampere University and Communication & Dissemination Lead at EuroCDP; Coordinator at FiCCC

Round table discussion:

  • Moderator: Pier Paolo Aurino, SCCC

SESSION B / 5th floor: Chip Packaging & heterogeneous integration

Advanced packaging and heterogeneous integration enable higher system performance through chiplets, 3D integration and advanced ASIC packaging. This session explores technology trends and opportunities for the Nordics.
Introduction: Feng-I Tai, Business Sweden

Confirmed speakers:

  • Dr. Teresa Orellana Pérez, Manager Business Development, APECS Pilot Line, Research Fab Microelectronics Germany (FMD)
  • Alan Moghal, Advanced Packaging Area Manager, Intel Ireland
  • Jari Arstila, Director, Murata Electronics

Round table discussion:

  • Moderator: Feng-I Tai, Business Sweden

⏤

14:00 - 14:30 Coffee break

⏤

14:30 - 16:00 Late afternoon · Choose one of two parallel sessions

SESSION C / 1st floor: AI Across the Semiconductor Lifecycle

AI is transforming semiconductor development, from requirements and architecture to design, verification, software enablement and customer adoption. This session brings together industry experts to explore how AI is transforming semiconductor industry.
Introduction: Steinar Brede, Innovation Norway

Confirmed speakers:

  • Kirill Bykov, Staff Engineer, Arm
  • Frode Sundal, Associate Director, Microchip
  • Jo Uthus, Executive VP, Nordic Semiconductor
  • David Conochie, CSO, IC optimize
  • Isto Hyyrylainen, Account Technical Executive, Cadence

Round table discussion:

  • Moderator: Steinar Brede, Innovation Norway

SESSION D / 5th floor: Talent Development & Attraction

Access to skilled talent is critical for a stronger semiconductor ecosystem. This session explores how the Nordics can attract, develop and retain talent through education, reskilling, international recruitment and collaboration.
Introduction: Sayani Majumdar, Associate Professor, Tampere University

Confirmed speakers:

  • Joachim Rodrigues, Lund University/ FAU (Friedrich-Alexander-Universität)/ BCDC
  • Carsten Wulff, NTNU / Nordic Semiconductor
  • Pierre-Alexandre Bou-Ach, Technical Director, Arm
  • Sofia Persson Björk, Manager Sales and Operation, Qamcom

Round table discussion:

  • Moderator: Sayani Majumdar, Associate Professor, Tampere University

⏤

16:00 - 16:15 Coffee break

⏤

16:15 - 17:00 Closing session and wrap-up, 1st floor

Coffee, snack, and mingling.

The day will conclude with an optional networking dinner at Radisson Blu Royal Garden Hotel (Kjøpmannsgata 73) at 19:00. Only for pre-registered attendees.

Day 2 - Wednesday 30 September

Participants of the Trondheim Chip Collaboration Meet-Up will have the opportunity to join exclusive company visits to some of Trondheim’s leading semiconductor and deep tech companies. These visits offer a unique opportunity to gain first-hand insights into cutting-edge technologies, advanced design, and innovation activities that are shaping the future of the Nordic chip ecosystem.

Due to capacity limitations, participation in the company visits is available to pre-registered attendees only, and registration is required in advance to secure a place.

Company Visits

9:00 Bus leaving from Radisson Blu Royal Garden Hotel (Pre-registered attendees only)
Kjøpmannsgata 73, Trondheim

Two buses will depart from the hotel at 09:00 sharp. Please note that all departures will follow the schedule outlined on the table below.
If you need to travel to the airport or another event during the day, all locations that we visit have access to public transportation and are also conveniently located near the Airport Express Coach (Flybussen) route.

9:15 Nordic Semiconductor (90min)
Otto Nielsens veg 12, Trondheim
Departure for Arm: 10:45

Get an insight into how we develop wireless technology and solutions of the future. The visit begins with a short introduction to the company and the technologies we work with. Participants will then be divided into smaller groups for guided tours of selected laboratories and development environments. The tour will offer a look at technology development, testing and innovation work at Nordic.

11:00 Arm Norway (90min)
Professor Brochs gate 8a, Trondheim
Departure for Microchip: 12:30

The visit will begin with a welcome and a presentation, "Arm Trondheim: From Mobile Graphics to Leading the AI Transformation", followed by a Q&A session. Participants will then have the opportunity to network and enjoy light refreshments.

12:45 Microchip (90min)
Brøsetvegen 164, Trondheim
Departure from for Radisson Blu Royal Garden Hotel: 14:15

Get a behind-the-scenes look at Microchip's Trondheim operations, including semiconductor development, innovation activities, and discussions with technical experts.

14:15 Bus return to Radisson Blu Royal Garden Hotel
Arriving back at the hotel approximately at 14:30

Due to high demand, registration has now closed. If you have a strong reason for attending, please contact info@nordicchipcollaboration.com.

For any questions about the event, please contact the NCC team at info@nordicchipcollaboration.com.

Arrangører

Innovasjon Norge, Nordic Chip Collaboration

Sted

Billett

Inkludert i festivalpass:
Nei
Pris:
Ekstra kostnad

Lenker

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